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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 17 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 1.0v to 5.5v, 1a 1ch termination regulators for ddr-sdrams BD3533F BD3533Fvm bd3533h fn general description bd3533 is a termination regulator that complies with jedec requirements for ddr-sdram. this linear power supply uses a built-in n-channel mosfet and high-speed op -amps specially designed to provide excellent transient response. it has a sink/source current capabilit y up to 1a and has a power supply bias requirement of 3.3v to 5.0v for driving the n-channel mosfet. by employing an independent reference voltage input (vddq) and a feedback pin (vtts), this termination regulator provides excellent output voltage accuracy and load regulation as required by jedec standards. additionally, bd3533 has a reference power supply output (vref) for ddr-sdram or for memory controllers. unlike the vtt output that goes to hi - z state, the vref output is kept unchanged when en input is changed to low, making this ic suitable for ddr -sdram under self refresh state. features ? incorporates a push-pull power supply for termination (vtt) ? incorporates a reference voltage circuit (vref) ? incorporates an enabler ? incorporates an under voltage lockout (uvlo) ? incorporates a thermal shutdown protector (tsd) ? compatible with dual channel (ddr-2) applications power supply for ddr 1/2 - sdram key specifications ? termination input voltage range: 1.0v to 5.5v ? vcc input voltage range: 2.7v to 5.5v ? vddq reference voltage range: 1.0v to 2.75v ? output voltage: 1/2 x v ddq v (typ) output current: BD3533F 3.0a(max) BD3533Fvm/hfn 1.0a(max) ? high side fet on-resistance: 0.4 ( typ) ? low side fet on-resistance: 0.4( typ) ? standby current: 0. 5ma(typ) ? operating temperature range: -20c to +100c packages w(typ) x d(typ) x h(max) typical application circuit, block diagram msop8 2.90mm x 4.00mm x 0.90mm h so n8 2.90mm x 3.00mm x 0.60mm sop8 5.00mm x 6.20mm x 1.71mm vcc vcc vddq vddq vtt_in v cc v cc v cc soft uvlo tsd reference block thermal protection enable en gnd vref vtts v ddq ? x vtt vtt vtt_in uvlo tsd en uvlo tsd en uvlo v cc tsd en uvlo en 1 2 4 3 8 7 5 6 downloaded from: http:/// datashee t
2/ 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 pin configuration pin descriptions description of blocks 1. vcc the vcc pin is for the independent power supply input that o perates the internal circuit of the ic. it is the voltage at th is pin that drives the ics amplifier circuits. the vcc input ranges from 3.3v to 5v and maximum current cons umption is 4ma. a bypass capacitor of 1 f or so should be connected to this pin when using the ic in an app lication circuit. 2. vddq this is the power supply input pin for an internal voltage divider network. the voltage at vddq is halved by two 50k internal voltage-divider resistors and the resulting volta ge serves as reference for the vtt output. since v tt = 1/2v ddq , the jedec requirement for ddr-sdram can be satisfied by supplying the co rrect voltage to vddq. noise input should be avoided at the vddq pin as it is al so included by the voltage-divider at the output. an rc fil ter consisting of a resistor and a capacitor (220? and 2.2f , for instance,) may be used to reduce the noise input but make sure that it will not significantly affect the voltage- dividers output. 3. vtt_in vtt_in is the power supply input pin for the vtt output. input voltage may range from 1.0v to 5.5v, but consideration must be given to the current limit dictated by the on -resistance of the ic and to the change in allowable loss d ue to input/output voltage difference. generally, the following voltages are supplied: ? ddr1 vtt_in = 2.5v ? ddr2 vtt_in = 1.8v take note that a high-impedance voltage input at vtt_in may result in oscillation or degradation in ripple reje ction, so connecting a 10f capacitor with minimal change in cap acitance to vtt_in terminal is recommended. however, this impedance may depend on the characteristics of the power s upply input and the impedance of the pc board wiring, which must be carefully checked before use. 4. vref bd3533 provides a constant voltage, vref, which is independe nt from the vtt output and can serve as reference input for memory controllers and drams. the voltage level of vref is kept constant even if the en pin is at low level, making the use of this ic compatible with the self refresh state of drams. in order to stabilize the output voltage, connecting the corre ct combination of capacitor and resistor to vref is necessary. for this purpose, a combination of 1.0f to 2.2f ceramic capacitor, characterized by minimal variati on in capacitance, and a 0.5? to 2.2? phase compensating resistor is recommended. a 10f cer amic or tantalum capacitor can also be used. the maximum current capability of the vref pin is 20ma, but for an application which consumes a small amount of vref current, using a capacitance of 1f or less will do. 5. vtts vtts is a sense pin for the load regulation of the vtt output voltage. in case the wire connecting vtt pin and the load is too long, connecting vtts pin to the part of the wire nearer to the load may improve load regulation. p in no. pin name pin function 1 gnd gnd pin 2 en enable input pin 3 vtts detector pin for termination voltage 4 vref reference voltage output pin 5 vddq reference voltage input pin 6 vcc vcc pin 7 vtt_in termination input pin 8 vtt termination output pin bottom (only bd3533hfn) fin substrate (connected to gnd) vtt_in gnd en vtts vref vtt vcc vddq 1 2 3 4 5 6 7 8 top view downloaded from: http:///
3/ 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 description of blocks - continued 6. vtt this is the output pin for the ddr memory termination voltage and it has a sink/source current capability of 1.0a. vtt voltage tracks the voltage at vddq pin divided in half. t he output is turned off when en pin is low or when either the vcc uvlo or the thermal shutdown protection function is activated. always connect a capacitor to vtt pin for loop gain and phase c ompensation and for reduction in output voltage variation in the event of sudden load change. be careful in choosing t he capacitor as insufficient capacitance may cause oscillatio n and high esr (equivalent series resistance) may result in i ncreased output voltage variation during a sudden change in load. using a low-esr ceramic capacitor, however, may reduc e the loop gain and phase margin and may cause oscillation. but this effect can be lessened by connecting a resistor in series with the capacitor. a 220f functional polymer capacitor (os-con, pos-cap, neo-cap) is recommended, though ambient temperature and other conditions should also be considered. 7. en a high input of 2.3v or higher to en turns on the vtt output. a low input of 0.8v or less, on the other hand, t urns vtt to a hi- z state. with a low en input, however, the vref output remains on, provided that sufficient vc c and vddq voltages have been established. absolute maximum ratings parameter symbol BD3533F BD3533Fvm bd3533hfn unit input voltage v cc 7 (note 1) v enable input voltage v en 7 (note 1) v termination input voltage v tt_in 7 (note 1) v vddq reference voltage v ddq 7 (note 1) v output current i tt 3 1 a power dissipation 1 pd1 0.56 (note 2) 0.43 (note 4) - w power dissipation 2 pd2 0.69 (note 3) - - w power dissipation 3 pd3 - - 0.63 (note 5) w power dissipation 4 pd4 - - 1.35 (note 6) w power dissipation 5 pd5 - - 1.75 (note 7) w operating temperature range topr -20 to +100 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax +150 c (note 1 ) should not exceed pd. instantaneous surge voltage, back electromotive fo rce and voltage under less than 10% duty cycle. (note 2) reduce by 4.48mw/c for ta over 25 c (with no heat sink). (note 3) reduce by 5.52mw /c for ta over 25 c (when mounted on a board 70mmx70mmx1.6mm glass-epoxy pcb). (note 4) reduce by 3.5mw /c for ta over 25 c (with no heat sink). (note 5) reduce by 5.04mw/ c for ta over 25 c (when mounted on a 70mmx70mmx1.6mm glass-epoxy board, 1-layer , copper foil area : less than 0.2%) (note 6) reduce by 10.8mw/ c for ta over 25 c (when mounted on a 70mmx70mmx1.6mm glass-epoxy board, 1-layer , copper foil area : less than 7.0%) (note 7) reduce by 14.0mw/ c for ta over 25 c (when mounted on a 70mmx70mmx1.6mm glass-epoxy board, 1-layer ,copper foil area : less than 65.0%) caution: operating the ic over the absolute maximum ratings may damage the ic. in addition, it is impossible to predict all destructive situations suc h as short-circuit modes, open circuit modes, etc. therefore, it is important to c onsider circuit protection measures, like adding a fuse, in case the ic is op erated in a special mode exceeding the absolute maximum ratings. recommended operating conditions (ta=25 c) parameter symbol min max unit input voltage v cc 2.7 5.5 v termination input voltage v tt_in 1.0 5.5 v vddq reference voltage v ddq 1.0 2.75 v enable input voltage v en -0.3 +5.5 v downloaded from: http:///
4/ 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 electrical characteristics (unless otherwise noted, ta=25 c v cc =3.3v v en =3v v ddq =1.8v v tt_in =1.8v) parameter symbol standard value unit conditions min typ max standby current i stby - 0.5 1.0 ma v en = 0v circuit current i cc - 2 4 ma v en =3v [enable] high level enable input voltage v enhigh 2.3 - 5.5 v low level enable input voltage v enlow -0.3 - +0.8 v enable pin input current i en - 7 10 a v en =3v [termination] termination output voltage 1 v tt1 v ref - 30m v ref v ref +30m v i tt =-1.0a to +1.0a ta=0 c to 100 c (note 9) termination output voltage 2 v tt2 v ref - 30m v ref v ref +30m v v cc =5v, v ddq =2.5v v tt_in =2.5v i tt =-1.0a to +1.0a ta=0 c to 100 c (note 9) source current i tt+ 1.0 - - a sink current i tt - - - -1.0 a load regulation ? v tt - - 50 mv i tt =-1.0a to +1.0a line regulation reg.l - 20 40 mv upper side on-resistance 1 r on1 _h - 0.45 0.9 lower side on-resistance 1 r on1 _l - 0.45 0.9 upper side on-resistance 2 r on2 _h - 0.4 0.8 v cc =5v, v dd q =2.5v v tt_in =2.5v lower side on-resistance 2 r on2 _l - 0.4 0.8 v cc =5v, v ddq =2.5v v tt_in =2.5v [input of reference voltage] input impedance z vddq 70 100 130 k output voltage1 v ref1 1/2xv ddq - 18m 1/2xv ddq 1/2xv ddq +18m v i ref =-5ma to +5ma ta=0 c to 100 c (note 9) output voltage2 v ref2 1/2xv ddq - 40m 1/2xv ddq 1/2xv ddq +40m v i ref =-10ma to +10ma ta=0 c to 100 c (note 9) output voltage3 v ref3 1/2xv ddq - 25m 1/2xv ddq 1/2xv ddq +25m v v cc =5v, v ddq =v tt_in =2.5v i ref =-5ma to +5ma ta=0 c to 100 c (note 9) output voltage4 v ref4 1/2xv ddq - 40m 1/2xv ddq 1/2xv ddq +40m v v cc =5v, v ddq =v tt_in =2.5v i ref =-10ma to +10ma ta=0 c to 100 c (note 9) [reference voltage] source current i ref+ 20 - - ma sink current i ref- - - - 20 ma [uvlo] uvlo off voltage v uvlo 2.40 2.55 2.70 v v cc : sweep up hysteresis voltage ? v uvlo 100 160 220 mv v cc : sweep down (note 9) design guarantee downloaded from: http:///
5/ 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 typical performance curves 1.244 1.246 1.248 1.250 1.252 1.254 1.256 1.258 -2 -1 0 1 2 itt(a) vtt(v) figure 3. termination output voltage vs output current (ddr-1) termination output voltage : v tt (v) output current : i tt (a) 0.89 0.89 0.90 0.90 0.90 0.90 0.90 0.91 0.91 -2 -1 0 1 2 itt(a) vtt (v) 0.896 0.898 0.900 0.902 0.904 0.906 0.908 0.910 0.912 ) figure 4. termination output voltage vs output current (ddr-2) termination output voltage : v tt (v) output current : i tt (a) 1.248 1.249 1.25 1.251 1.252 -10 -5 0 5 10 iref(ma) vref(v) figure 1. output voltage vs i ref (ddr-1) output voltage : v ref (v) i ref (ma) 0.897 0.898 0.899 0.9 0.901 0.902 -10 -5 0 5 10 iref(ma) vref(v) figure 2. output voltage vs i ref (ddr-2) output voltage : v ref (v) i ref (ma) downloaded from: http:///
6/ 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 typical waveforms figure 5 . ddr 1 (-1a to +1a) vtt(20mv/div) itt(1a/div) 10 sec/div vtt(20mv/div) itt(1a/div) 10 sec/div figure 6. ddr 1 (+1a to - 1a ) vtt(20mv/div) itt(1a/div) 10 sec/div figure 7. ddr 2 (- 1a to +1a) vtt(20mv/div) itt(1a/div) 10 sec/div figure 8. ddr 2 (+1a to -1a) downloaded from: http:///
7/ 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 typical waveforms C continued vcc en vddq vtt_in vtt figure 9. input sequence 1 vcc en vddq vtt_in vtt figure 10 . input sequence 2 vcc en vddq vtt_in vtt figure 11 . input sequence 3 vtt_in vref vtt (1a/div) itt_in figure 12 . start up waveform downloaded from: http:///
8/ 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 application information 1. evaluation board part no value company parts name part no value company parts name u1 - rohm bd3533 c4 - - - r1 - - - c5 10 f kyocera cm21b106m06a r4 220 rohm mcr032200 c6 - - - j1 0 - - c7 - - - j2 0 - - c8 - - - c1 - - - c9 2.2f kyocera cm105b225k06a c2 10 f kyocera cm21b106m06a c10 220 f sanyo 2r5tpe220mf c3 1f kyocera cm105b105k06a evaluation board application components silk screen t op layer bottom layer BD3533F (sop8 ) evaluation board layout bd3533 evaluation board circuit c 5 ,c 6 gnd vref en vcc vddq vtt_in vtts vtt gnd v cc sw1 j 2 r 4 c 9 j 1 c 3 ,c 4 c 7 = c 8 c 10 c 2 c 1 r 1 2 7 5 6 1 8 3 4 u1 vtt_in vcc vtt vref vddq en vtts gnd bd3533 downloaded from: http:///
9/ 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 2. power dissipation in thermal design, consider the temperature range wherein the ic is guaranteed to operate and apply appropriate margins. the temperature conditions that need to be conside red are listed below: (1) ambient temperature ta: 100c or lower (2) chip junction temperature tj: 150c or lower the chip s junction temperature tj can be considered as follows. ( se e the diagrams below for ja.) most heat loss in bd3533 occurs at the output n-channel fet. the lost power is determined by multiplying the voltage between in and out by the output current. since this ic is packaged for high-power applications, its thermal derati ng characteristics significantly depend on the pc board. so whe n designing, the size of the pc board to be used should be carefully considered. power dissipation (w) = {input voltage (v tt _ in ) C output voltage (v tt 1/2v ddq )} x i out (ave) for instance, v tt_in = 1.8v , v ddq =1.8v, and i out (ave)=0.5a. the power dissipation is determined as follows: ? ? ? ? ? ? ? ? ? ? ? ? w a v v w n dissipatio power 4.0 5.0 9.0 8.1 ? ? ? ? sop8 msop8 hson8 (1) 70mmx70mmx1.6mm glass-epoxy pcb j -a=181 c /w (2) with no heat sink j -a=222 c /w power dissipation [pd] ambient temperature [ta] 100 100 600 0 25 75 125 150 50 200 100 0 [ c ] 400 500 300 [mw] (2) 560mw (1) 690mw 700 with no heat sink j -a=286 c /w ambient temperature [ta] 100 10 0 437.5mw power dissipation [pd] [mw] 0 25 75 125 150 50 [ c ] 200 100 0 400 500 300 125 150 power dissipation [pd] 0 25 75 100 50 [ c ] ambient temperature [ta] 1.0 0.5 0 2.0 1.5 (1) 0.63w (2) 1.35w (3) 1.75w [w] (1) 1 layer substrate (substrate surface copper foil area: below 0.2 %) j -a=198.4c/w (2) 2 layer substrate (substrate surface copper foil area:7%) j -a=92.4c/w (3) 2 layer substrate (substrate surface copper foil area:65%) j -a=71.4c/w downloaded from: http:///
10 / 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an externa l diode between the power supply and the ics power supp ly terminals. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the ana log block. furthermore, connect a capacitor to ground at all power supply pins. con sider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin a t any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-si gnal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxi mum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board . in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the p d rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditi ons of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that th e internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence a nd delays, especially if the ic has more than one power su pply. therefore, give special consideration to power coupling capa citance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boar ds when testing the ic on an application board, connecting a c apacitor directly to a low-impedance output pin may sub ject the ic to stress. always discharge capacitors completely afte r each process or step. the ics power supply should always be turned off completely before connecting or removi ng it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during ass embly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mou nting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) an d unintentional solder bridge deposited in between pins during as sembly to name a few. 11. unused input terminals input terminals of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the ele ctric field from the outside can easily charge it. the sm all charge acquired in this way is enough to produce a sign ificant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input terminals should be connected to the powe r supply or ground line. downloaded from: http:///
11 / 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 operational notes C continued 12. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrate l ayers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 13. example of monolithic ic structure 13. thermal shutdown circuit (tsd) this ic has a built-in thermal shutdown circuit that preven ts heat damage to the ic. normal operation should always be w ithin the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls be low th e tsd threshold, the circuits are automatically restored to normal oper ation. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. the present ic incorporates a thermal shutdown protection c ircuit (tsd circuit). the working temperature is 175c (standard value) and has a -15c (standard value) hysteresis width. 14. capacitor across output and gnd if a large capacitor is connected between the output pin and gro und pin, current from the charged capacitor can flow into the output pin and may destroy the ic when the vcc or vtt_in pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 1 00 0f between output and ground. 15. output capacitor (c 1 ) do not fail to connect a output capacitor to vref output terminal for s tabilization of output voltage. the capacitor connected to vref output terminal works as a loop gain pha se compensator . insufficient capacitance may cause an oscillation. it is recommended to use a low temperature coe fficient 1- 10 f ceramic capacitor, though it depends on ambient temperature and load conditions. it is therefore reque sted to carefully check under the actual temperature and load conditions to be applied. 16. ou tput capacitor (c 4 ) do not fail to connect a capacitor to vtt output pin for stabiliz ation of output voltage. this output capacitor works as a loop gain phase compensator and an output voltage varia tion reducer in the event of sudden change in load. insufficient capacitance may cause an oscillation. and i f the equivalent series resistance (esr) of this capacitor is high, the variation in output voltage increases in the event of sudden change in load. it is recommended to use a 47- 220 f functional polymer capacitor, though it depends on ambi ent temperature and load conditions. using a low esr ceramic capacitor may reduce a loop gain phase margin and cau se an oscillation, which may be improved by connecting a resistor in series with the capacitor. it is therefore reques ted to carefully check under the actual temperature and load conditions to be applied. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
12 / 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 operational notes C continued 17. input capacitors (c 2 and c 3 ) these input capacitors are used to reduce the output imp edance of power supply to be connected to the input term inals (vcc and vtt_in). increase in the power supply output impedance ma y result in oscillation or degradation in ripple rejecting characteristics. it is recommended to use a low temp erature coefficient 1f (for vcc) and 10f (for vtt_in) capacitor, but it depends on the characteristics of the pow er supply input, and the capacitance and impedance of th e pc board wiring pattern. it is therefore requested to carefully che ck under the actual temperature and load conditions to be applied. 18. input terminals (vcc, vddq, vtt_in and en) vcc, vddq, vtt_in and en terminals of this ic are made up independe nt from one another. to vcc terminal, the uvlo function is provided for malfunction protection . irrespective of the input order of the inputs terminals, vtt outpu t is activated to provide the output voltage when uvlo and en vol tages reach the threshold voltage, while vref output is activated when uvlo voltage reaches the threshold. if vddq and vtt_in terminals have equal potential and common impedance, any change in current at vtt_in terminal may result in variation of vtt_in voltage, which affects vddq terminal and may cause variation in the output voltage. it i s therefore required to perform wiring in such manner that vddq and vtt_in terminals may not have common impedance. if i mpossible, take appropriate corrective measures including suitable cr filter to be inserted between vddq and vtt_in terminal s. 19. vtts terminal this terminal is used to improve load regulation of vtt outp ut. the connection with vtt terminal must be done so that i t would not have a common impedance with high current line for be tter load regulation of vtt output. 20. operating range within the operating range, the operation and function of the circu its are generally guaranteed at an ambient temperature within the range specified. the values specified for electri cal characteristics may not be guaranteed, but drastic chan ge may not occur to such characteristics within the operating range. 21. allowable loss pd for the allowable loss, the thermal derating characteristics a re shown on page 9, which should be used as a guide. any use that exceeds the allowable loss may result in d egradation in the functions inherent to ic including a decre ase in current capability due to chip temperature increase. use within th e allowable loss. 22. built-in thermal shutdown protection circuit thermal shutdown protection circuit is built- in to prevent thermal breakdown. turns vtt output to off when the thermal shutdown protection circuit activates. this thermal shutdown protection circuit is originally intended to protect the ic itself. it is therefore requested to conduct a thermal de sign not to exceed the temperature under which the thermal shutdown protection circuit can work. 23. the use of the ic in a strong electromagnetic field may sometimes cause malfunctio n, to which care must be taken. in the event that a load containing a large inductance component is conne cted to the output terminal, and generation of bac k-emf at the start-up and when output is turned off is assumed, it is recommended to insert a protection diode. 24. in the event that load containing a large inductance componen t is connected to the output terminal, and generation of back-emf at th e start-up and when output is turned off is assumed, it is requested to insert a protection diode. 25. application circuit although we can recommend the application circuits containe d herein with a relatively high degree of confidence, we ask that you verify all characteristics and specif ications of the circuit as well as its performance under actual conditions. please note that we cannot be held responsible for problems that may arise due to patent infringements or noncompliance with any and a ll applicable laws and regulations. output pin (example) downloaded from: http:///
13 / 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 ordering information b d 3 5 3 3 x x x - x x part number package f : sop8 fvm : msop8 hfn : hson8 packaging and forming specification tr emboss tape reel opposite draw-out side: 1 pin e2 emboss tape reel opposite draw-out side: 1 pin marking diagrams part number marking package orderable part number d3533 sop8 BD3533F- e2 d3533 msop8 BD3533Fvm- tr bd3533 hson8 bd3533hfn- tr msop8(top view) d 3 5 part number marking lot number 1pin mark 3 3 sop8(top view) d 3 5 3 3 part number marking lot number 1pin mark hson8 (top view) 53 3 part number marking lot number 1pin mark b d 3 downloaded from: http:///
14 / 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 physical dimension, tape and reel information package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
15 / 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 physical dimension, tape and reel information C continued package name msop8 downloaded from: http:///
16 / 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 physical dimension, tape and reel information C continued package name hson8 downloaded from: http:///
17 / 17 BD3533F BD3533Fvm bd3533hfn ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a900700-1-2 08.apr.2016 rev.003 revision history date revision changes 07.mar.2014 001 new release 22.jul.2015 002 revised applications 08.apr.2016 003 p.13/17 marking diagrams revised msop8 downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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